ENME 765
Thermal Issues in Electronic Systems
An overview of thermal management for micro/power electronics systems and helps engineers understand emerging thermal technologies. It will include the following topics: the background of electronics packaging, thermal design of heat sinks, single-phase and multiphase flow in thermal systems, two-phase heat exchange devices for portable and high-powered electronic systems, and computational fluid dynamics for the design of thermal systems.
Topics
- the background of electronics packaging
- thermal design of heat sinks
- single-phase and multiphase flow in thermal systems
- two-phase heat exchange devices for portable and high-powered electronic systems
- and computational fluid dynamics for the design of thermal systems
Topics explicitly listed in official catalogue description
Prerequisites & course information
Credit Only Granted for: ENME765 or ENME808D. Formerly: ENME808D. Additional Information: Students must have prior coursework similar to the content offered in undergraduate courses ENME331 , ENME332 , and ENME473 .
Sources
- Course catalogue ↗2026-2027