Manufacturing Technologies for Electronic Systems

3 Credits

This highly multi-disciplinary course presents the mechanical fundamentals of manufacturing processes used in electronics assemblies. The emphasis is on quantitative modeling of the intrinsic impact that processing has on structure, properties, performance and durability. Students will learn how to quantitatively model many of the key manufacturing steps from mechanistic first principles, so that sensitivity studies and process optimization can be performed in a precise manner. Processes considered include: wafer-level processes such as polishing, lithography, etching and dicing; packaging operations such as die attachment, wirebonding, flip chip bonding, and plastic encapsulation; multilevel high-density substrate fabrication processes; assembly processes such as reflow and wave soldering of surface-mount components to electronic substrates.