2.830
Control of Manufacturing Processes
Statistical modeling and control in manufacturing processes. Use of experimental design and response surface modeling to understand manufacturing process physics. Defect and parametric yield modeling and optimization. Forms of process control, including statistical process control, run by run and adaptive control, and real-time feedback control. Application contexts include semiconductor manufacturing, conventional metal and polymer processing, and emerging micro-nano manufacturing processes.
Spring 2008 · Control of Manufacturing Processes (SMA 6303)
Topics
- Introduction — processes and variation framework
- Semiconductor process variation
- Mechanical process variation — physical causes and interpreting data
- Probability models of manufacturing processes
- Probability models, parameter estimation, and sampling
- Sampling distributions and statistical hypotheses
- Shewhart SPC and process capability
- Process capability and alternative SPC methods
- Advanced and multivariate SPC
- Yield modeling
- Introduction to analysis of variance
- Full factorial models
- Modeling testing and fractional factorial models
- Aliasing and higher order models
- Response surface modeling and process optimization
- Process robustness
- Nested variance components
- Sequential experimentation: “Experimentation and Robust Design and Engineering Systems.”
- Case study 1: tungsten CVD DOE/RSM
- Case study 2: cycle to cycle control
- Case study 3: spatial modeling
- Case study 4: “Modeling the Embossing/Imprinting of Thermoplastic Layers.”
- Project presentations 1
- Project presentations 2
Readings
- Montgomery, Douglas C. Introduction to Statistical Quality Control. 5th ed. New York, NY: Wiley, 2004. ISBN: 9780471656319.
- May, Gary S., and Costas J. Spanos. Fundamentals of Semiconductor Manufacturing and Process Control . Hoboken, NJ: Wiley-Interscience, 2006. ISBN: 9780471784067.
- Boning, Duane S., et al. “A General Semiconductor Process Modeling Framework.” IEEE Transactions on Semiconductor Manufacturing 5 (November 1992): 266-280.
- Ciplickas, Dennis J., et al. “Predictive Yield Modeling of VLSIC’s.” IEEE 5th International Workshop on Statistical Metrology (June 2000): 28-37.
- Stapper, Charles H., and Raymond J. Rosner. “Integrated Circuit Yield Management and Yield Analysis: Development and Implementation.” IEEE Transactions on Semiconductor Manufacturing 8 (May 1995): 95-102.
- Drain, Davis. “Variance Components and Process Sampling Design.” Chapter 3 in Statistical Methods for Industrial Process Control . New York, NY: Chapman & Hall, 1996. ISBN: 9780412085116.
- Rzepniewski, Adam K., et al. “Cycle-to-Cycle Control of Multivariable Manufacturing Processes with Process Model Uncertainty.” ASME International Mechanical Engineering Congress and Exposition (2004): IMECE2004-61783.
- Guo, Ruey-Shan, and Emanuel Sachs. “Modeling, Optimization, and Control of Spatial Uniformity in Manufacturing Processes.” IEEE Transactions on Semiconductor Manufacturing 6 (February 1993): 41-57.
- Davis, Joseph C., et al. “A Robust Metric for Measuring Within-Wafer Uniformity.” IEEE Transactions on Components, Packaging, and Manufacturing Technology C 19 (October 1996): 283-289.
- Mozumder, Purnendu K., and Lee M. Loewenstein. “Method for Semiconductor Process Optimization Using Functional Representations of Spatial Variations and Selectivity.” IEEE Transactions on Components, Hybrids, and Manufacturing Technology 15 (June 1992): 311-316.
Prerequisites & course information
Same subject as 6.6630J Prereq: 2.008 , 6.2600[J] , or 6.3700 G (Fall) 3-0-9 units
Sources
- Course catalogue ↗2026–2027
- MIT OpenCourseWare ↗Spring 2008
- MIT OCW calendar ↗
- MIT OCW syllabus ↗
- MIT OCW readings ↗
- Historical MIT OpenCourseWare offering. Named reading entries and schedule topics are automatically extracted from the linked source pages.