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ESD.63

Control of Manufacturing Processes (SMA 6303)

Graduate · Historical course

Spring 2008

Topics

  • Introduction — processes and variation framework
  • Semiconductor process variation
  • Mechanical process variation — physical causes and interpreting data
  • Probability models of manufacturing processes
  • Probability models, parameter estimation, and sampling
  • Sampling distributions and statistical hypotheses
  • Shewhart SPC and process capability
  • Process capability and alternative SPC methods
  • Advanced and multivariate SPC
  • Yield modeling
  • Introduction to analysis of variance
  • Full factorial models
  • Modeling testing and fractional factorial models
  • Aliasing and higher order models
  • Response surface modeling and process optimization
  • Process robustness
  • Nested variance components
  • Sequential experimentation: “Experimentation and Robust Design and Engineering Systems.”
  • Case study 1: tungsten CVD DOE/RSM
  • Case study 2: cycle to cycle control
  • Case study 3: spatial modeling
  • Case study 4: “Modeling the Embossing/Imprinting of Thermoplastic Layers.”
  • Project presentations 1
  • Project presentations 2

Readings

  • Montgomery, Douglas C. Introduction to Statistical Quality Control. 5th ed. New York, NY: Wiley, 2004. ISBN: 9780471656319.
    Required
  • May, Gary S., and Costas J. Spanos. Fundamentals of Semiconductor Manufacturing and Process Control . Hoboken, NJ: Wiley-Interscience, 2006. ISBN: 9780471784067.
    Required
  • Boning, Duane S., et al. “A General Semiconductor Process Modeling Framework.” IEEE Transactions on Semiconductor Manufacturing 5 (November 1992): 266-280.
    Listed reading
  • Ciplickas, Dennis J., et al. “Predictive Yield Modeling of VLSIC’s.” IEEE 5th International Workshop on Statistical Metrology (June 2000): 28-37.
    Listed reading
  • Stapper, Charles H., and Raymond J. Rosner. “Integrated Circuit Yield Management and Yield Analysis: Development and Implementation.” IEEE Transactions on Semiconductor Manufacturing 8 (May 1995): 95-102.
    Listed reading
  • Drain, Davis. “Variance Components and Process Sampling Design.” Chapter 3 in Statistical Methods for Industrial Process Control . New York, NY: Chapman & Hall, 1996. ISBN: 9780412085116.
    Listed reading
  • Hardt, D. E., and Tsz-Sin Siu. “ Cycle to Cycle Manufacturing Process Control .” SMA , 2002. ↗
    Listed reading
  • Rzepniewski, Adam K., et al. “Cycle-to-Cycle Control of Multivariable Manufacturing Processes with Process Model Uncertainty.” ASME International Mechanical Engineering Congress and Exposition (2004): IMECE2004-61783.
    Listed reading
  • Guo, Ruey-Shan, and Emanuel Sachs. “Modeling, Optimization, and Control of Spatial Uniformity in Manufacturing Processes.” IEEE Transactions on Semiconductor Manufacturing 6 (February 1993): 41-57.
    Listed reading
  • Davis, Joseph C., et al. “A Robust Metric for Measuring Within-Wafer Uniformity.” IEEE Transactions on Components, Packaging, and Manufacturing Technology C 19 (October 1996): 283-289.
    Listed reading
  • Mozumder, Purnendu K., and Lee M. Loewenstein. “Method for Semiconductor Process Optimization Using Functional Representations of Spatial Variations and Selectivity.” IEEE Transactions on Components, Hybrids, and Manufacturing Technology 15 (June 1992): 311-316.
    Listed reading
Sources