Microelectronics Packaging and Thermal Management

3 Hours

Explore basics of semiconductor fabrication, microelectronics packaging techniques, thermomechanical issues in packaging, reliability-related aspects in packaging, thermal management conditions, Conduction-based cooling, air and liquid cooling, phase change-based cooling, role of packaging materials. Discuss challenges and solutions at multiple length scales, from transistors (nanometers) to data centers (10's of meters). Mechanical Engineering 397 (Topic: Microelectronics Pckg: Fndmtls) and Mechanical Engineering 381R (Topic 8) may not both be counted. Three lecture hours a week for one semester.