Materials for Semiconductor Packaging and Heterogeneous Integration

3 Hours

Explore the process of integrating separately manufactured components into a higher-level assembly. Examine how materials play a critical role in protecting the chips, ensuring reliable operation, efficient thermal management, and for the development of smaller, lighter, and more powerful devices. Focus on materials for package substrates, thermal interface materials, materials for interconnects and for encapsulation, and materials for thermal management and immersion cooling, as well as novel materials that are currently under development. Three lecture hours a week for one semester.