Semiconductor Materials Processing

3 credits · Undergraduate

Materials processing unit operations of silicon device manufacturing. Basic semiconductor physics and device theory, production of substrates, dopant diffusion, ion implantation, thermal oxidation and deposition processes, plasma deposition processes, photolithography, wet chemical and plasma etching, and analytical techniques. One 75-minute lecture and one 2-hour laboratory each week. No credit for students who have earned credit for CHBE 5850. [3]