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ESE 4361

Semiconductor Fabrication Lab

3 units

This course provides a comprehensive, hands-on introduction to semiconductor processing, focusing on the design, layout, fabrication, and testing of semiconductor devices from start to finish. Throughout the semester, students will learn key techniques and principles in semiconductor device fabrication, including wafer preparation, thermal oxidation, photolithography, doping (activation and diffusion), deposition (CVD, PVD, and ALD), etching (wet and dry), annealing, passivation, and chemical mechanical polishing (CMP). The course highlights the critical role of plasma physics and chemistry in modern semiconductor manufacturing, covering topics such as reactive ion etching (RIE) and plasma-enhanced chemical vapor deposition (PECVD). In addition, students will gain hands-on experience with industry-standard simulation tools used in semiconductor design and analysis. Through a combination of lectures and weekly lab sessions, students will acquire practical experience in cleanroom environments, mastering the tools and processes required to create functional semiconductor devices. The course culminates in final presentations, where students will share their results and analysis.

Prerequisites & course information

Credit 3 units. Typical periods offered: Spring

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